Browse Prior Art Database

Application of Low Silver Loading Conductive Adhesives to Surface Mounting

IP.com Disclosure Number: IPCOM000041143D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Huang, WS: AUTHOR [+4]

Abstract

Conductive Adhesives with A Low Silver Content (less than 65%) can be used to surface mount components to printed circuit boards.

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This is the abbreviated version, containing approximately 100% of the total text.

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Application of Low Silver Loading Conductive Adhesives to Surface Mounting

Conductive Adhesives with A Low Silver Content (less than 65%) can be used to surface mount components to printed circuit boards.

Silver powders spherical particles of size approximately 5-8 microns are homogeneously dispersed in a quantity of an epoxy adhesive with about 4% of a catalyst present. This conductive adhesive mixture is then dispersed onto copper pads of the printed circuit boards which is then cured for 15-20 minutes at 85-95oC. Leads of the chips are then pressed through the top of the pad to the bottom. The populated printed circuit board assembly is then re-heated to complete curing of the adhesive.

High conductivity has been found to occur using low percentage content silver adhesives according to the above process.

Disclosed anonymously.

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