Browse Prior Art Database

Complete Module Ceramic Circuitized Cap

IP.com Disclosure Number: IPCOM000041153D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Williams, KH: AUTHOR

Abstract

This article describes the use of the underside (inside) area of a non-metallic cap (cover) of a semiconductor device for circuitry or for component placement, thereby increasing the density without increasing the real estate. The underside of the cap can have circuitry etched into or deposited onto it and can include active devices, passive devices, semiconductor chips, etc. After proper surface preparation, conventional processes can be used for the formation and attachment of the circuit and components.

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Complete Module Ceramic Circuitized Cap

This article describes the use of the underside (inside) area of a non-metallic cap (cover) of a semiconductor device for circuitry or for component placement, thereby increasing the density without increasing the real estate. The underside of the cap can have circuitry etched into or deposited onto it and can include active devices, passive devices, semiconductor chips, etc. After proper surface preparation, conventional processes can be used for the formation and attachment of the circuit and components.

To achieve electrical connection between the cap and semiconductor substrate, etched fingers coming down the inside of the cap make physical contact with opposing fingers from the substrate. These fingers from the cap and the substrate can be brazed or soldered together if desired.

Disclosed anonymously.

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