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Improved Module Pin Life Design

IP.com Disclosure Number: IPCOM000041158D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Erickson, AJ: AUTHOR [+3]

Abstract

One problem which may lead to pin failure in a semiconductor module is excessive solder volume resulting from the pin dipping process. Excess volume can lead to a large moment arm and force applied to the pin/braze and braze/ceramic interfaces. A solder stop to cover the braze can help in preserving the solder plating profile. A thermoplastic powder can be deposited to the pin side of a ceramic substrate and reflowed in place. Then the solder dipping process can proceed without an excessive amount of solder being deposited at the pin/braze interface.

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Improved Module Pin Life Design

One problem which may lead to pin failure in a semiconductor module is excessive solder volume resulting from the pin dipping process. Excess volume can lead to a large moment arm and force applied to the pin/braze and braze/ceramic interfaces. A solder stop to cover the braze can help in preserving the solder plating profile. A thermoplastic powder can be deposited to the pin side of a ceramic substrate and reflowed in place. Then the solder dipping process can proceed without an excessive amount of solder being deposited at the pin/braze interface.

Disclosed anonymously.

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