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A Technique for Isolating Contamination On Wafer Chucks

IP.com Disclosure Number: IPCOM000041169D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Katz, SM: AUTHOR

Abstract

Due to the critical nature of proper focus in photolithographic exposure tools, contamination on the wafer chuck can be of serious consequence. A technique is disclosed herein, for visual verification of chuck cleanliness.

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A Technique for Isolating Contamination On Wafer Chucks

Due to the critical nature of proper focus in photolithographic exposure tools, contamination on the wafer chuck can be of serious consequence. A technique is disclosed herein, for visual verification of chuck cleanliness.

The technique consists of exposure and development of an aggressive masking pattern (near the resolution limit of the exposure tool) in a serpentine or staircase pattern. If the wafer chuck has particulates on it, the developed image will show a radial pattern of striations. This pattern will emanate from the site of the contamination and will be visible to the naked eye. Since the position of the particle is isolated, cleaning of the chuck is simplified. Repeating the process will verify the cleanliness of the chuck.

As a result of this technique, contamination on the wafer chuck can be observed and its position isolated. This will significantly aid in the maintenance of a particulate-free wafer chuck with no additional tooling and no special processing.

Anonymous.

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