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Browse Prior Art Database

Polyimide Top Coat for Decals

IP.com Disclosure Number: IPCOM000041189D
Original Publication Date: 1987-Nov-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Clementi, RJ: AUTHOR [+3]

Abstract

A polyimide top coat is applied to the circuit side of a polyimide film chip carrier to provide electrical insulation of the circuitry to prevent contact with a chip or any foreign matter. The top coat is applied and works in the following manner.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Polyimide Top Coat for Decals

A polyimide top coat is applied to the circuit side of a polyimide film chip carrier to provide electrical insulation of the circuitry to prevent contact with a chip or any foreign matter. The top coat is applied and works in the following manner.

A polyimide film is coated with successive layers of chromium (CR), copper (Cu) and chromium (Cr) to build circuit lines. A photolithographic process is used to define the desired personality of the Cr/Cu/Cr layers.

A top coat is applied in a thin (1-10 m) coating to cover the Cr/Cu/Cr layers and etched at selected areas for chip attach and module assembly.

(Image Omitted)

The resulting configuration is seen in the drawing. A controlled collapse chip connector pad 1 is provided for chip attachment and the Cr/Cu/Cr layers 2 are electrically insulated from the chip (not seen) by the thin top polyimide coat 3.

Disclosed anonymously.

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