Browse Prior Art Database

Solder Seal for Semiconductor Package

IP.com Disclosure Number: IPCOM000041206D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Prasad, C: AUTHOR

Abstract

This solder seal and process for making it requires heating only to low temperatures, yet achieves improved and dependable wettability by tinning the solder seal surfaces with a high melting paint tinning layer.

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Solder Seal for Semiconductor Package

This solder seal and process for making it requires heating only to low temperatures, yet achieves improved and dependable wettability by tinning the solder seal surfaces with a high melting paint tinning layer.

In the process the seal band surfaces of the cap and substrate are pre-tinned by placing a thin Pb-Sn solder preform with a Sn content in the range of 5 to 15% by weight. After heating to flow the preform, the pre-tinned surfaces are cooled and the cap and substrate assembled with a low melting point Pb-Sn solder preform positioned therebetween. The solder has a Sn content in the range of 60 to 63%, with the rest being Pb.

Disclosed anonymously.

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