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Process for Making Electroplated Metal Lines With Controlled Edge Slope

IP.com Disclosure Number: IPCOM000041217D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cronin, JE: AUTHOR [+2]

Abstract

A photoresist process normally used for the formation of lift-off patterns is used to guide the growth of electroplated metal. This will define the shape of the deposited metal.

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Process for Making Electroplated Metal Lines With Controlled Edge Slope

A photoresist process normally used for the formation of lift-off patterns is used to guide the growth of electroplated metal. This will define the shape of the deposited metal.

Referring to Fig. 1, photresist 2 is applied over a thin conductive layer 4 formed on insulating substrate 6. Photoresist 2 is exposed and developed to define a resist pattern having undercut edges.

Fig. 2 shows the results of electroplating metal 8 onto the exposed portion of conductive layer 4 to nearly fill the opening in photoresist 2.

Fig. 3 shows the cross-section of metal line 8 after removal of photoresist 2 and all of conductive film 4 not covered by electropated film 8.

Thus, a metal line is formed having edges sloped to be compatible with subsequent insulating film deposition, that is, a slope that avoids the danger of unfilled crevices at line edges, such as can occur when line edges are vertical or undercut.

Disclosed anonymously.

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