Browse Prior Art Database

Conductive Grid/3d Moldings

IP.com Disclosure Number: IPCOM000041228D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Cook, LG: AUTHOR [+3]

Abstract

Electrostatic build-up over time can cause product break-down when a product is stored or transported in molded plastic carriers or containers equipped with clear windows. This article concerns the employment of conductive film and grid combination affixed to the container window so as to assure both a consistent electrostatic decay (ESD) rate and adequate transparency for visual identification of the contents.

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Conductive Grid/3d Moldings

Electrostatic build-up over time can cause product break-down when a product is stored or transported in molded plastic carriers or containers equipped with clear windows. This article concerns the employment of conductive film and grid combination affixed to the container window so as to assure both a consistent electrostatic decay (ESD) rate and adequate transparency for visual identification of the contents.

Containers for the storage and transport of electronic parts and assemblies, e.g., electronic cards, thermal conduction modules, etc., are capable of effecting product break-down due to electrostatic charge build-up over time, particularly when equipped with clear windows. ESD commercial coatings now exist to combat or eliminate this problem, but these coatings are affected in time by humidity and their effectiveness is diminished. The disclosed technique will eliminate static build-up on a permanent basis and is not affected by humidity. A conductive grid pattern is first printed on a film which allows adequate transparency for visual purposes. The conductive grid film is laminated and/or molded over the window of the container. An area of the grid is left exposed for connection to the conductive container. With connection of the grid to the conductive surface of the container, the ESD decay rate (which will depend upon the grid pattern spacing chosen) will be made consistent and greatly improved.

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