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Ultra Clean Aluminum Surface by Vaporizing off a Chemical Film in a Vacuum

IP.com Disclosure Number: IPCOM000041233D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Wirsing, CE: AUTHOR

Abstract

A method is described for depositing an electroless nickel or other metallic plate over an aluminum substrate. Prior art methods suffer from a blistering problem in marine other corrosive environments.

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Ultra Clean Aluminum Surface by Vaporizing off a Chemical Film in a Vacuum

A method is described for depositing an electroless nickel or other metallic plate over an aluminum substrate. Prior art methods suffer from a blistering problem in marine other corrosive environments.

Conventional processes utilize a double zincate deposition process followed by the deposition of electroless nickel. A pit-through of the electroless nickel to the zincate, however, can result in a blister when subjected to salt water spray. This problem can be minimized by subliming away the zincate layer at high temperature and low vacuum, thereby leaving an oxide-free layer ready for the vacuum deposition of copper. Electroless nickel can then be applied to the copper in the conventional manner.

Disclosed anonymously.

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