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Browse Prior Art Database

Machine Vision Inspection in the Infrared Spectrum

IP.com Disclosure Number: IPCOM000041236D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Antonie, CH: AUTHOR [+2]

Abstract

Described is a method for inspecting module pins using infrared machine vision. This method can detect bent pins without regard to the proper form of the solder tips.

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This is the abbreviated version, containing approximately 100% of the total text.

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Machine Vision Inspection in the Infrared Spectrum

Described is a method for inspecting module pins using infrared machine vision. This method can detect bent pins without regard to the proper form of the solder tips.

Current thermal vision technology allows for detection of temperature differences as low as 0.5 degrees C. This capability can be used to detect bent pins on a semiconductor module. Heating or cooling the pins as the module approaches the inspection point results in the transmission of the infrared radiation from the pins. This infrared radiation can then be detected by an infrared camera which can give a picture of the pin profile. This overcomes the problems in the prior art that rely on reflection of radiant energy for bent pin detection.

Disclosed anonymously.

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