Browse Prior Art Database

Capillary Action Flux Dispenser

IP.com Disclosure Number: IPCOM000041254D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Horton, R: AUTHOR

Abstract

A solder flux applicator consist of a reservoir for flux storage and a teflon applicator for flux delivery. The reservoir, shown in the figure uses a sponge for flux transfer to the applicator. Wicking of flux up the sponge constantly keeps the upper surface of the sponge wet, independent of the amount of flux in the reservoir. Channels are machined in the face of the applicator, as shown in the figure. When the applicator face contacts the sponge by capillary action, the grooves fill with flux. Surface tension between the applicator and the flux and the depth of the groove controls the amount of flux pickup.

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Capillary Action Flux Dispenser

A solder flux applicator consist of a reservoir for flux storage and a teflon applicator for flux delivery. The reservoir, shown in the figure uses a sponge for flux transfer to the applicator. Wicking of flux up the sponge constantly keeps the upper surface of the sponge wet, independent of the amount of flux in the reservoir. Channels are machined in the face of the applicator, as shown in the figure. When the applicator face contacts the sponge by capillary action, the grooves fill with flux. Surface tension between the applicator and the flux and the depth of the groove controls the amount of flux pickup.

This applicator is useful in microelectronics to deposit onto contact pads a uniform and controlled amount of solder flux by placing the flux filled grooves in contact with the pads. Solder flux can be deposited onto any number of pads on a substrate. The grooves of the applicator are formed to correspond to the contact pad locations.

Disclosed anonymously.

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