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Enhanced Stability for Thermal Grease

IP.com Disclosure Number: IPCOM000041267D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ameen, JG: AUTHOR [+5]

Abstract

During stress testing of modules, the thermal conductivity of the grease decreases. The mechanism involves the wicking of the silicone oil throughout the cap, thus causing voids of oil in the grease formulation. This phenomenon also minimizes solder joint life due to the lack of heat dissipation. To eliminate the above problems, one drop (.05 cc) of silicone oil is placed either on the predispensed thermal grease or the premounted chip just prior to back-seal. This compensates for the wicking of the silicone oil.

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Enhanced Stability for Thermal Grease

During stress testing of modules, the thermal conductivity of the grease decreases. The mechanism involves the wicking of the silicone oil throughout the cap, thus causing voids of oil in the grease formulation. This phenomenon also minimizes solder joint life due to the lack of heat dissipation. To eliminate the above problems, one drop (.05 cc) of silicone oil is placed either on the predispensed thermal grease or the premounted chip just prior to back-seal. This compensates for the wicking of the silicone oil.

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