Browse Prior Art Database

Thick Copper (Screened) Film Sealing Band for Module Mounted Semiconductor Chips

IP.com Disclosure Number: IPCOM000041280D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Palmateer, PH: AUTHOR [+2]

Abstract

U.S. Patents 3,993,123 and 4,245,273 show heat exchange structures for cooling module-mounted semiconductor chips. Described here is a method for joining substrate modules directly to heat exchange caps by utilizing a thick film copper, screened and fired, seal band. Thick film copper offers the advantage of a tight non-porous bond to the Al2O3 module substrate (see above patents). The copper band may be applied after sintering by silk-screening techniques and fired at approximately 900ŒC in an oxygen-free atmosphere. The band may then be capped with a Au (plated) flash of tinned (plated or solder reflow). The Pb plated C-Ring should easily seal hermetically with the copper tinned band. See figures below.

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Thick Copper (Screened) Film Sealing Band for Module Mounted Semiconductor Chips

U.S. Patents 3,993,123 and 4,245,273 show heat exchange structures for cooling module-mounted semiconductor chips. Described here is a method for joining substrate modules directly to heat exchange caps by utilizing a thick film copper, screened and fired, seal band. Thick film copper offers the advantage of a tight non-porous bond to the Al2O3 module substrate (see above patents). The copper band may be applied after sintering by silk-screening techniques and fired at approximately 900OEC in an oxygen-free atmosphere. The band may then be capped with a Au (plated) flash of tinned (plated or solder reflow). The Pb plated C-Ring should easily seal hermetically with the copper tinned band. See figures below.

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