Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method of Selectively Copper Plating Molybdenum Structures on Multilayer Ceramic Substrates

IP.com Disclosure Number: IPCOM000041316D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Bayer, T: AUTHOR [+4]

Abstract

A method is proposed, by means of which metal structures arranged on or embedded in an isolating material can be selectively copper plated. A copper salt solution, in which the copper ion is preferably present in a complex form, is applied to the structure to be copper plated, using a high-voltage (Tesla, corona) discharge. For this purpose, a Tesla electrode, applied outside the solution in the vicinity of the structure to be metallized, is ignited. A counter electrode is not required. In another arrangement, the Tesla electrode is immersed in the copper salt solution, and the structure to be copper plated is connected to ground potential. In the illustrated embodiment, the Tesla electrode is contacted at the molybdenum conductors of a multilayer ceramic (MLC) substrate which are not immersed in the solution.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Method of Selectively Copper Plating Molybdenum Structures on Multilayer Ceramic Substrates

A method is proposed, by means of which metal structures arranged on or embedded in an isolating material can be selectively copper plated. A copper salt solution, in which the copper ion is preferably present in a complex form, is applied to the structure to be copper plated, using a high-voltage (Tesla, corona) discharge. For this purpose, a Tesla electrode, applied outside the solution in the vicinity of the structure to be metallized, is ignited. A counter electrode is not required. In another arrangement, the Tesla electrode is immersed in the copper salt solution, and the structure to be copper plated is connected to ground potential. In the illustrated embodiment, the Tesla electrode is contacted at the molybdenum conductors of a multilayer ceramic (MLC) substrate which are not immersed in the solution. Bath - aqueous copper salt solution with the following data

(Image Omitted)

The described method is also suitable for applying other metal films, such as nickel, gold, palladium, and the like.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]