Browse Prior Art Database

Heat Transfer and Power Decoupling Assembly

IP.com Disclosure Number: IPCOM000041317D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 103K

Publishing Venue

IBM

Related People

Gruber, H: AUTHOR [+4]

Abstract

An assembly, comprising differently shaped metal sheets 1 (Figs. 1, 2) of beryllium, copper or a similar metal, is mounted between the upper surface of the chip 2 and several substrate power pins 3 to provide a cheap cooling means. One group of power pins 3, required for one voltage level, is connected to one metal sheet 1. Metal sheets 1 are separated by ceramic disk capacitors 4. The heat transfer and power decoupling assembly is pressed on to power pins 3, using the spring washer technique. The largest group of power pins, which is connected to one voltage level, extends through and is soldered to a metal cap. The assembly has good decoupling properties. Low-inductance metal sheets 1 are connected to ceramic disk capacitors 4, forming a multilayer high-frequency decoupling assembly.

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Heat Transfer and Power Decoupling Assembly

An assembly, comprising differently shaped metal sheets 1 (Figs. 1, 2) of beryllium, copper or a similar metal, is mounted between the upper surface of the chip 2 and several substrate power pins 3 to provide a cheap cooling means. One group of power pins 3, required for one voltage level, is connected to one metal sheet 1. Metal sheets 1 are separated by ceramic disk capacitors 4. The heat transfer and power decoupling assembly is pressed on to power pins 3, using the spring washer technique. The largest group of power pins, which is connected to one voltage level, extends through and is soldered to a metal cap. The assembly has good decoupling properties. Low-inductance metal sheets 1 are connected to ceramic disk capacitors 4, forming a multilayer high-frequency decoupling assembly. Power pins 1 are connected by this assembly. Decoupling chip capacitors are no longer required on substrate 5. The power distribution on substrate 5 is improved, as metal sheets 1 act as power planes. The connection of a group of power pins 3 by a metal sheet 1 improves the power distribution on substrate 5 (module). Power pins 3 can be evenly distributed on substrate 5 to reduce the coupling between signal pins. The positioning of the power pins does not limit the signal fan-out and wiring on substrate 5. A simple mechanical set-up can be used to press-fit the assembly on to power pins 3.

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