Browse Prior Art Database

Stress Measurement Wafer Holder

IP.com Disclosure Number: IPCOM000041349D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

deHodgins, OC: AUTHOR

Abstract

Complete photo-elastic analysis can be carried out using only the plane or circular polariscope, which is in fact the basic apparatus of photo-elasticity. The specimen under this kind of analysis should be mounted on a straining frame constructed in such a way as to enable any part of the model to be brought into the light beam from the polarizer. The specimen should be properly fixed into the frame by holders that will not impose stresses during loading. The frame shown here includes special clamps for wafers. Specific variations may be necessary to suit the requirements of a particular investigation. The holder shown here runs non-destructive tensile and compressive tests.

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Stress Measurement Wafer Holder

Complete photo-elastic analysis can be carried out using only the plane or circular polariscope, which is in fact the basic apparatus of photo-elasticity. The specimen under this kind of analysis should be mounted on a straining frame constructed in such a way as to enable any part of the model to be brought into the light beam from the polarizer. The specimen should be properly fixed into the frame by holders that will not impose stresses during loading. The frame shown here includes special clamps for wafers. Specific variations may be necessary to suit the requirements of a particular investigation. The holder shown here runs non-destructive tensile and compressive tests. It is faster to use than epoxy, presents less risk of breaking specimen due to shear before test starts, and is adjustable to balance and relieve strain due to clamping in the x and y directions. It is also readily mountable on X-ray instruments, INSTRON* machines and in straining frames in general. The figure illustrates, in two dimensions, holders for stress tests for glass or silicon wafers (ceramics). It has advantages over the wide use of epoxy resins and allows faster testing to be made, and wide areas for experimental and reliable observations. Moreover, it allows adjusting strain in the sample once the sample is being positioned and is designed to interface with straining frames, INSTRON machines and X-ray instruments (X-ray small angle scattering and w...