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ESD Testing for Data Processor With Multiple Simultaneous Discharge of Probes to Connected Processor Frame

IP.com Disclosure Number: IPCOM000041350D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

SooHoo, KM: AUTHOR [+2]

Abstract

Several probes for an electrostatic discharge (ESD) test are applied to different points of the frame of a data processor. The probes are energized two or more at a time to produce several simultaneous discharges in the neighborhood of the frame, and the effects of the discharge are sampled. The simultaneous multiple discharges provide test information that is not provided by sequential discharges at the same points. When an electrostatic discharge occurs near a data processor, the radiation may be picked up by wires of the processor circuits and may cause a fault in the processor operation. For testing, one electrode of a spark gap is connected to a selected point on the metal frame of the processor. The voltage source is adjustable, and test discharges are made over a range of voltages.

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ESD Testing for Data Processor With Multiple Simultaneous Discharge of Probes to Connected Processor Frame

Several probes for an electrostatic discharge (ESD) test are applied to different points of the frame of a data processor. The probes are energized two or more at a time to produce several simultaneous discharges in the neighborhood of the frame, and the effects of the discharge are sampled. The simultaneous multiple discharges provide test information that is not provided by sequential discharges at the same points. When an electrostatic discharge occurs near a data processor, the radiation may be picked up by wires of the processor circuits and may cause a fault in the processor operation. For testing, one electrode of a spark gap is connected to a selected point on the metal frame of the processor. The voltage source is adjustable, and test discharges are made over a range of voltages. In one type of test, the processor is observed to detect an operating fault such as a parity error. In a second type of test, sensors are located at selected points within the enclosure to pick up signals from the discharge currents that flow in the processor frame. These tests may indicate that the processor meets or fails the discharge at a particular voltage or it may indicate that particular components of the processor are susceptible to the discharge and require additional shielding or relocation to a more shielded place within the frame. In this test, the discharge vo...