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E-Beam Postexposure of a Photoresist to Improve Resistance Against Electrolyte Attack

IP.com Disclosure Number: IPCOM000041398D
Original Publication Date: 1984-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Forster, T: AUTHOR

Abstract

In Josephson technology, anodized Nb2O5 can be used for window definition in the fabrication of planar or edge junctions. Ordinarily, a photoresist is used to pattern the Nb film to be anodized. An E-beam flood exposure technique is proposed which results in a significant increase in the resistance of the photoresist against the attack of the electrolyte used in the anodization process, thereby providing a suitable mask for Nb anodization. After completing the resist pattern, which may involve the steps of coating, prebaking, optical or E-beam exposing, postbaking, the resist is exposed to an E-beam flood exposure of about 200 x 10-6 coulomb/cm2 . Probably because of partial cross-linking, the E-beam exposed resist exhibits a highly increased resistance against electrolyte attack.

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E-Beam Postexposure of a Photoresist to Improve Resistance Against Electrolyte Attack

In Josephson technology, anodized Nb2O5 can be used for window definition in the fabrication of planar or edge junctions. Ordinarily, a photoresist is used to pattern the Nb film to be anodized. An E-beam flood exposure technique is proposed which results in a significant increase in the resistance of the photoresist against the attack of the electrolyte used in the anodization process, thereby providing a suitable mask for Nb anodization. After completing the resist pattern, which may involve the steps of coating, prebaking, optical or E-beam exposing, postbaking, the resist is exposed to an E-beam flood exposure of about 200 x 10-6 coulomb/cm2 . Probably because of partial cross-linking, the E- beam exposed resist exhibits a highly increased resistance against electrolyte attack. It has been found that the proposed E-beam postexposure also results in improved adhesion of the resist during anodization.

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