Browse Prior Art Database

CONTACT TRANSFER FLUX APPLICATOR

IP.com Disclosure Number: IPCOM000041540D
Original Publication Date: 1984-Feb-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Geany, GM: AUTHOR [+4]

Abstract

It is important that a selective amount of flux be placed at the appropriate MLC (multilayer ceramic) substrate chip sites. In the past this has been accomplished by using time pressure methods through screens, masks or an orifice, or by the most basic way of applying the flux by hand. Fig. 1 shows a schematic diagram of the flux applicator system. The flux is pumped from the reservoir 10 to the platen 12 surface. A doctor blade 13 wipes the top surface of the platen 12, leaving the desired film thickness of flux thereon. Transfer head 11 is arranged to move in the downward direction until the transfer probes 14 contact the platen 12, allowing flux to fill the probe cavities. The head 11 is retracted and moved horizontally to the correct position over the chip site on the substrate 16 (Fig. 4).

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CONTACT TRANSFER FLUX APPLICATOR

It is important that a selective amount of flux be placed at the appropriate MLC (multilayer ceramic) substrate chip sites. In the past this has been accomplished by using time pressure methods through screens, masks or an orifice, or by the most basic way of applying the flux by hand. Fig. 1 shows a schematic diagram of the flux applicator system. The flux is pumped from the reservoir 10 to the platen 12 surface. A doctor blade 13 wipes the top surface of the platen 12, leaving the desired film thickness of flux thereon. Transfer head 11 is arranged to move in the downward direction until the transfer probes 14 contact the platen 12, allowing flux to fill the probe cavities. The head 11 is retracted and moved horizontally to the correct position over the chip site on the substrate 16 (Fig. 4). The transfer head 11 is lowered, allowing the probes 14 to contact the chip site area. As the head retracts, a film of flux is transferred from the probe cavities to the chip site. The transfer head 11 can be seen in more detail in Figs. 2 and 3. Fig. 2 is a top view showing the ability of the probe to be locked into the up position. Fig. 3 shows the probes and the spring loading thereof into the up position as well as the depth of the cavity at the end of the probe. Since each probe is spring-loaded and guided, this compensates for any substrate camber. The probes are locked into the upper position by selective rotation so that they do not...