Browse Prior Art Database

Interposer for Chip-On-Chip Module Attachment

IP.com Disclosure Number: IPCOM000041547D
Original Publication Date: 1984-Feb-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Feinberg, I: AUTHOR [+3]

Abstract

An interposer structure is disclosed for mounting silicon chip-on-chip (COC) assemblies on ceramic substrates and for establishing electrical and mechanical connections to the substrates. COC is shown in Fig. 1. Figs. 2A and 2B show the interposer electrically and mechanically connecting the COC to a ceramic module. The interposer preferably is made of a glass-like material having a thermal coefficient of expansion between those of the silicon chips and of the ceramic module. In its simplest form, the interposer maps the chip input/output (I/O) terminals to the module I/O. In more complex forms, multilayer interposers also can perform fan-out and redistribution functions between COC assemblies.

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Interposer for Chip-On-Chip Module Attachment

An interposer structure is disclosed for mounting silicon chip-on-chip (COC) assemblies on ceramic substrates and for establishing electrical and mechanical connections to the substrates. COC is shown in Fig. 1. Figs. 2A and 2B show the interposer electrically and mechanically connecting the COC to a ceramic module. The interposer preferably is made of a glass-like material having a thermal coefficient of expansion between those of the silicon chips and of the ceramic module. In its simplest form, the interposer maps the chip input/output (I/O) terminals to the module I/O. In more complex forms, multilayer interposers also can perform fan-out and redistribution functions between COC assemblies. In any event, the interposer surrounds the bottom chip and provides direct connections between the top chip and the module without passing through the bottom chip.

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