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Method of Optimizing the Adhesion of Copper Films on Epoxy Resin Surfaces of Printed Circuit Boards

IP.com Disclosure Number: IPCOM000041620D
Original Publication Date: 1984-Feb-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hinkel, H: AUTHOR [+3]

Abstract

A gel coating film is deposited and precured on the laminate of a printed circuit board. Subsequently, a copper film is applied by vapor deposition or sputtering. Using pressure and heat, the gel coating is softened and made to optimally adhere to the copper film. The gel coating is a low-viscosity resin of the same basic structure as the material of the circuit boards or a similar resin. Good adhesion of the copper film is obtained by proceeding as follows: 1. Coating the printed circuit boards with a gel coating of an epoxy resin or a similar material with a layer thickness of 5 to 50 um. 2. Drying and precuring the film at 50 to 100ŒC (Tg of gel coating less than Tg of printed circuit boards), so that the film is still able to gel. 3.

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Method of Optimizing the Adhesion of Copper Films on Epoxy Resin Surfaces of Printed Circuit Boards

A gel coating film is deposited and precured on the laminate of a printed circuit board. Subsequently, a copper film is applied by vapor deposition or sputtering. Using pressure and heat, the gel coating is softened and made to optimally adhere to the copper film. The gel coating is a low-viscosity resin of the same basic structure as the material of the circuit boards or a similar resin. Good adhesion of the copper film is obtained by proceeding as follows: 1. Coating the printed circuit boards with a gel coating of an epoxy resin or a similar material with a layer thickness of 5 to 50 um. 2. Drying and precuring the film at 50 to 100OEC (Tg of gel coating less than Tg of printed circuit boards), so that the film is still able to gel. 3. Vapor depositing or sputtering the copper film with a layer thickness of 50 to 5000 nm. 4. Providing the printed circuit boards thus coated with separating foils and introducing them into a laminating press. The desired adhesion is obtained in this step by applying pressure and heat. The low-energy, low-viscosity gel coating wets the high-energy copper film, thus ensuring good adhesion.

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