Browse Prior Art Database

Heat Pipe Spreader Plate

IP.com Disclosure Number: IPCOM000041642D
Original Publication Date: 1984-Feb-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Pioli, AA: AUTHOR [+3]

Abstract

The figure describes the concept of using a heat pipe 1 to remove heat from a small densely packed, high power module 2 to a large cold plate 3. The heat pipe 1, which has a very low thermal resistance when compared to an equally sized solid metal plate, spreads the heat from the small cap area of the module 2 to the larger contact area of the cold plate 3. Increasing the area of the heat transfer path into the cold plate 3 results in a decrease in overall cold plate thermal resistance. Although the heat pipe adds thermal resistance to the heat flow path, for a properly sized heat pipe/cold plate design, the thermal resistance added by the heat pipe will be less than the decrease in thermal resistance of the cold plate. The net result is an overall decrease in thermal resistance from chip to cold plate.

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Heat Pipe Spreader Plate

The figure describes the concept of using a heat pipe 1 to remove heat from a small densely packed, high power module 2 to a large cold plate 3. The heat pipe 1, which has a very low thermal resistance when compared to an equally sized solid metal plate, spreads the heat from the small cap area of the module 2 to the larger contact area of the cold plate 3. Increasing the area of the heat transfer path into the cold plate 3 results in a decrease in overall cold plate thermal resistance. Although the heat pipe adds thermal resistance to the heat flow path, for a properly sized heat pipe/cold plate design, the thermal resistance added by the heat pipe will be less than the decrease in thermal resistance of the cold plate. The net result is an overall decrease in thermal resistance from chip to cold plate. This allows for higher chip powers in the module.

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