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Composite Foil of Indium and Silver for Mounting Circuit Module to Cold Plate

IP.com Disclosure Number: IPCOM000041656D
Original Publication Date: 1984-Feb-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 20K

Publishing Venue

IBM

Related People

Antonetti, VW: AUTHOR [+2]

Abstract

A thin foil has an inner layer of silver and outer layers of indium. The silver layer makes the foil stiff enough for easy handling when the foil is assembled between a thermally cooled circuit module (TCM) and its cold plate. A thin layer of indium is sufficient to conform to surface irregularities of the TCM and the cold plate for improved heat transfer. The silver is compatible with the indium and has high thermal conductivity. The stiffened foil can be made significantly thinner than the conventional foil of all indium which is given extra thickness to provide stiffness. The drawing shows an edge view of a TCM, a cold plate, and the foil. The thickness of the layers of the foil is exaggerated in the drawing.

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Composite Foil of Indium and Silver for Mounting Circuit Module to Cold Plate

A thin foil has an inner layer of silver and outer layers of indium. The silver layer makes the foil stiff enough for easy handling when the foil is assembled between a thermally cooled circuit module (TCM) and its cold plate. A thin layer of indium is sufficient to conform to surface irregularities of the TCM and the cold plate for improved heat transfer. The silver is compatible with the indium and has high thermal conductivity. The stiffened foil can be made significantly thinner than the conventional foil of all indium which is given extra thickness to provide stiffness. The drawing shows an edge view of a TCM, a cold plate, and the foil. The thickness of the layers of the foil is exaggerated in the drawing.

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