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Browse Prior Art Database

Solder Preform and Method of Sealing

IP.com Disclosure Number: IPCOM000041843D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Leney, JE: AUTHOR

Abstract

In using solder preforms to form a solder seal in package applications, the failure to properly wet a solderable surface may result in defective seals. This laminated solder preform 10 has a layer 12 (10% Sn-90% Pb) joined to a layer 14 of pure Sn. The relative thicknesses of layers 12 and 14 are adjusted so that the overall composition of the preform is 60% Sn-40% Pb. The improved wettability of the laminated preform may be due to the fact that it melts over a range of temperatures, instead of a single temperature, as with 60% Sn-40% Pb solder. Preforms of various compositions and thicknesses may be useful in other applications for which a low melting eutectic is required as the end result.

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Solder Preform and Method of Sealing

In using solder preforms to form a solder seal in package applications, the failure to properly wet a solderable surface may result in defective seals. This laminated solder preform 10 has a layer 12 (10% Sn-90% Pb) joined to a layer 14 of pure Sn. The relative thicknesses of layers 12 and 14 are adjusted so that the overall composition of the preform is 60% Sn-40% Pb. The improved wettability of the laminated preform may be due to the fact that it melts over a range of temperatures, instead of a single temperature, as with 60% Sn-40% Pb solder. Preforms of various compositions and thicknesses may be useful in other applications for which a low melting eutectic is required as the end result.

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