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Power Transistor Heat Sink Clamp Plate

IP.com Disclosure Number: IPCOM000041888D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Joy, EF: AUTHOR [+2]

Abstract

A transistor heat sink assembly is described which facilitates flow soldering of the transistor to a printed circuit card. A heat sink clamp plate 1 is a stamped and formed part made of 0.032 inch thick aluminum. A notch 2 is formed therein to hold the body of a transistor 3 for proper alignment on a heat sink 4. A slot 5 is formed on each side of the notch 2 to allow vertical confirmation of the heat sink 4 and the clamp plate 1 to the height of the transistor 3. The clamp plate 1 is mounted to the heat sink 4 by means of two thread-forming screws 6. During the assembly process, the transistor 3 is first flow soldered to a printed circuit card. Thereafter, the heat sink 4 with a thermal compound applied thereto is attached to the transistor 3 by means of the clamp plate 1 and the mounting screws 6.

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Power Transistor Heat Sink Clamp Plate

A transistor heat sink assembly is described which facilitates flow soldering of the transistor to a printed circuit card. A heat sink clamp plate 1 is a stamped and formed part made of 0.032 inch thick aluminum. A notch 2 is formed therein to hold the body of a transistor 3 for proper alignment on a heat sink 4. A slot 5 is formed on each side of the notch 2 to allow vertical confirmation of the heat sink 4 and the clamp plate 1 to the height of the transistor 3. The clamp plate 1 is mounted to the heat sink 4 by means of two thread-forming screws 6. During the assembly process, the transistor 3 is first flow soldered to a printed circuit card. Thereafter, the heat sink 4 with a thermal compound applied thereto is attached to the transistor 3 by means of the clamp plate 1 and the mounting screws 6. This assembly process prevents heat sinking of the flow solder bath, contamination of the solder bath by the thermal compound, and contamination of the cleaning solution after the solder bath.

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