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Flexible Bridging Module

IP.com Disclosure Number: IPCOM000041971D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Bickford, HR: AUTHOR [+4]

Abstract

Double-hinged flexible bridging modules are capable of making bridging contacts for low-temperature circuit modules even though the modules bridged have surfaces which are not all in the same plane. Fig. 1 shows chips 1 and 2 connected by flexible bridging module 3. The double-hinged bridging module 3 is fabricated as shown in Fig. 2 and as described below: a) A substrate 4, chosen principally for its coefficient of thermal expansion and stiffness, is coated with a slow-etching thin film material 5 (Fig. 2A). Thermally oxidized silicon might be used, for instance. b) Two elongated channels 6 are made by suitable means, such as etching, so that the thin film 5 membrane across the channel bottom remains intact (Fig. 2B). c) A film 7 of elastic material is deposited on (or laminated to) the bottom of the structure (Fig. 2C).

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Flexible Bridging Module

Double-hinged flexible bridging modules are capable of making bridging contacts for low-temperature circuit modules even though the modules bridged have surfaces which are not all in the same plane. Fig. 1 shows chips 1 and 2 connected by flexible bridging module 3. The double-hinged bridging module 3 is fabricated as shown in Fig. 2 and as described below: a) A substrate 4, chosen principally for its coefficient of thermal expansion and stiffness, is coated with a slow-etching thin film material 5 (Fig. 2A). Thermally oxidized silicon might be used, for instance. b) Two elongated channels 6 are made by suitable means, such as etching, so that the thin film 5 membrane across the channel bottom remains intact (Fig. 2B). c) A film 7 of elastic material is deposited on (or laminated to) the bottom of the structure (Fig. 2C). At this time, the underlying thin film may be removed in the area of the channels, if so desired. d) Additional thin film deposition and patterning processes are used to produce ground plane metallurgy 8, insulation 9, wiring plane metallurgy 10, passivation 11, and contact metallurgy 12 in required configuration (Fig. 2D). e) The bridging module is positioned and contacts are formed. f) The bridging module 3 is separated from the bulk of the substrate, by dicing, for example, with two cuts being made perpendicularly through the elongated channels. (See Fig. 1.) A bridging module might additionally be hinged in the ortho...