Browse Prior Art Database

Low Cost, High Performance Cooling Package

IP.com Disclosure Number: IPCOM000042017D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Dorler, JA: AUTHOR [+5]

Abstract

This package embodies a resilient heat-conductive interface layer between a ceramic cap that encloses the semiconductor devices and a water-cooled cold plate. Package 10 has a substrate 12, preferably of multilayer ceramic with an internal metallurgy system, devices 14 mounted on the surface, for example, by solder bonding, along with capacitors 16 also mounted on the surface. A ceramic cap 18 is solder joined to the seal band 20 with a solder preform 22. Cap 18 has a recess in the underside (not shown) that provides clearance for devices 14 and capacitors 16. A suitable conductive medium or linkage is provided to conduct heat from the backside of chips 14 to the underside of ceramic cap 18.

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Low Cost, High Performance Cooling Package

This package embodies a resilient heat-conductive interface layer between a ceramic cap that encloses the semiconductor devices and a water-cooled cold plate. Package 10 has a substrate 12, preferably of multilayer ceramic with an internal metallurgy system, devices 14 mounted on the surface, for example, by solder bonding, along with capacitors 16 also mounted on the surface. A ceramic cap 18 is solder joined to the seal band 20 with a solder preform 22. Cap 18 has a recess in the underside (not shown) that provides clearance for devices 14 and capacitors 16. A suitable conductive medium or linkage is provided to conduct heat from the backside of chips 14 to the underside of ceramic cap 18. A water-cooled cold plate 24 is positioned above cap 18 that is provided with water inlet 26 and outlet 28 for joining to a suitable means for circulating water. The thermal conduction between cap 18 and cold plate 24 is enhanced by a thermal interface layer 30 formed of a resilient but highly heat conductive material. Pins (not shown) are provided on the bottom side of substrate 12 for insertion into suitable sockets on a board or card. A suitable means, for example, bolts or clamps, (not illustrated), mounted on the board or card is provided separately for forcing the cold plate 24 into intimate contact with the top side of ceramic cap 18. The afore-described module is capable of cooling high performance chips and is yet relatively...