Browse Prior Art Database

Substrate Solder Seal-Capping Spider

IP.com Disclosure Number: IPCOM000042037D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Castro, HJ: AUTHOR

Abstract

Disclosed is a fixture (referred to herein as a spider), typically fabricated from a metal, for precisely positioning module caps on multichip module (MCM) substrates for the solder seal process. Figs. 1 and 2 are the bottom and side views of the spider. The spider has four identical legs 11-14. At the bottom surface of each leg is provided two mutually perpendicular surfaces 15 and 16 for precise registration of the spider with the corners of the substrate. In the body of the spider at the bottom surface thereof is provided a diamond-shaped surface 17 for precise registration with the like-shaped reinforcement band on the module cap and thereby aligning the cap with the spider. The upper surface of the spider body contains a cylindrical pocket 18 for receiving a magnet therein.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 90% of the total text.

Page 1 of 2

Substrate Solder Seal-Capping Spider

Disclosed is a fixture (referred to herein as a spider), typically fabricated from a metal, for precisely positioning module caps on multichip module (MCM) substrates for the solder seal process. Figs. 1 and 2 are the bottom and side views of the spider. The spider has four identical legs 11-14. At the bottom surface of each leg is provided two mutually perpendicular surfaces 15 and 16 for precise registration of the spider with the corners of the substrate. In the body of the spider at the bottom surface thereof is provided a diamond-shaped surface 17 for precise registration with the like-shaped reinforcement band on the module cap and thereby aligning the cap with the spider. The upper surface of the spider body contains a cylindrical pocket 18 for receiving a magnet therein. In use, the module cap is placed in a nesting plate. The spider is positioned on the nesting plate so that the diamond-shaped reinforcement band on the cap is aligned with the diamond-shaped surface 17 on the spider. Then, a magnet is placed in the spider pocket 18 to secure the module cap to the spider surface 17. The entire assembly of spider, magnet and cap is picked up and positioned on the module substrate 19 (mounted on a production carrier 20, Fig. 3) so that the module cap 21 is aligned with the substrate. The magnet is then removed and the carrier is fed into a furnace for solder seal processing. The above fixture can be modified by providing...