Browse Prior Art Database

Canted Tier Wafer Dome

IP.com Disclosure Number: IPCOM000042078D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Brown, WW: AUTHOR [+2]

Abstract

On conventional semiconductor wafer domes used in vacuum systems, the wafers are placed (Figs. 1A and 1B) side-by-side in tiers or rings in a dome structure. Typically, the wafers are placed in holders which are inserted in rings or openings of the dome. These rings are located on specified radii from the center of the dome in a configuration which positions the wafers perpendicular to an evaporant source on a spacing which avoids shadowing from adjacent wafers or holders. There is usually more than one tier of rings, located one below the other at increasing diameters from the dome center so that the bottom wafers do not block the ones above it from the evaporant stream. It was found that by locating the rings closer to each other and tilting the holders, then at a predetermined angle (e.g., 10.

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Canted Tier Wafer Dome

On conventional semiconductor wafer domes used in vacuum systems, the wafers are placed (Figs. 1A and 1B) side-by-side in tiers or rings in a dome structure. Typically, the wafers are placed in holders which are inserted in rings or openings of the dome. These rings are located on specified radii from the center of the dome in a configuration which positions the wafers perpendicular to an evaporant source on a spacing which avoids shadowing from adjacent wafers or holders. There is usually more than one tier of rings, located one below the other at increasing diameters from the dome center so that the bottom wafers do not block the ones above it from the evaporant stream. It was found that by locating the rings closer to each other and tilting the holders, then at a predetermined angle (e.g., 10.5OE), the space normally occupied by the wafer holders can be reduced by letting the edges of abutting holders overlap. This allows more usable space on the dome for the wafers. As a result, an increase of about 15% in the number of wafers can be processed in existing systems without any system modification and no sacrifice in evaporation deposition uniformity. See Figs. 2A, 2B and 2C.

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