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Browse Prior Art Database

Improved Method of Mounting Chip Capacitors

IP.com Disclosure Number: IPCOM000042116D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Horstmann, RE: AUTHOR [+3]

Abstract

Chip capacitor mounting to circuit boards is improved by using a controlled collapse solder arrangement. The mounting of discrete components, such as ceramic chip capacitors 11 shown in Fig. 1, to circuit boards 12 in Fig. 2 by solder dip or wave techniques will provide sufficient stress to cause failure of the joint 13. As shown in Figs. 3 and 4, the proposed method uses the well-known elastic properties of the controlled collapse solder member 14, applied to the capacitor terminations 15, which have been repositioned to only one surface of the capacitor.

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Improved Method of Mounting Chip Capacitors

Chip capacitor mounting to circuit boards is improved by using a controlled collapse solder arrangement. The mounting of discrete components, such as ceramic chip capacitors 11 shown in Fig. 1, to circuit boards 12 in Fig. 2 by solder dip or wave techniques will provide sufficient stress to cause failure of the joint 13. As shown in Figs. 3 and 4, the proposed method uses the well-known elastic properties of the controlled collapse solder member 14, applied to the capacitor terminations 15, which have been repositioned to only one surface of the capacitor.

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