Browse Prior Art Database

Differential Solubility Wire

IP.com Disclosure Number: IPCOM000042141D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Varker, KJ: AUTHOR

Abstract

It is known that circuit boards can be fabricated by adhering insulated wires to a substrate. Such boards are made by laying the wires down on an adhesive and drilling holes where connections to the wires are desired. Improved connections to the wires in such boards can be made by utilizing wire which has two layers of insulation, namely, an inner layer and an outer layer. The inner layer which is next to the copper wire is made of a soluble material, whereas the outer layer is made of an insoluble material. After the holes in the board are drilled, they are cleaned with a material which dissolves the inner layer of insulation around the ends of the wire. In this way when the holes are plated, a better electrical connection is made to the wire.

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Differential Solubility Wire

It is known that circuit boards can be fabricated by adhering insulated wires to a substrate. Such boards are made by laying the wires down on an adhesive and drilling holes where connections to the wires are desired. Improved connections to the wires in such boards can be made by utilizing wire which has two layers of insulation, namely, an inner layer and an outer layer. The inner layer which is next to the copper wire is made of a soluble material, whereas the outer layer is made of an insoluble material. After the holes in the board are drilled, they are cleaned with a material which dissolves the inner layer of insulation around the ends of the wire. In this way when the holes are plated, a better electrical connection is made to the wire.

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