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Browse Prior Art Database

Chlorofluorocarbon Polymers for Improved Circuit Boards

IP.com Disclosure Number: IPCOM000042147D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ellis, TE: AUTHOR [+4]

Abstract

Fluorocarbon plastics as a generic class have low dielectric constants and good temperature and chemical resistance, but are poor in bonding and other processing characteristics. Chlorofluorocarbon plastics (or polymers) have low dielectric constants, also, and, in addition, process well, having superior bonding capabilities and can be crosslinked. Air has a lower dielectric constant than any solid. Air can be included in materials, such as described above, in a foam. This product can be used as a wire insulation with, for example, a dielectric constant of 1.5. Chlorofluorocarbon polymers, either solid or foam, can be used as base-laminating material for circuit boards. They can be reinforced with supporting particulate, fibrous, or woven materials (fiberglass, aramid fiber, etc.

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Chlorofluorocarbon Polymers for Improved Circuit Boards

Fluorocarbon plastics as a generic class have low dielectric constants and good temperature and chemical resistance, but are poor in bonding and other processing characteristics. Chlorofluorocarbon plastics (or polymers) have low dielectric constants, also, and, in addition, process well, having superior bonding capabilities and can be crosslinked. Air has a lower dielectric constant than any solid. Air can be included in materials, such as described above, in a foam. This product can be used as a wire insulation with, for example, a dielectric constant of 1.5. Chlorofluorocarbon polymers, either solid or foam, can be used as base- laminating material for circuit boards. They can be reinforced with supporting particulate, fibrous, or woven materials (fiberglass, aramid fiber, etc.) if higher strength or higher modules are desired. A wire-embedding adhesive can be formulated using such low dielectric constant materials. Such a material could take advantage of the ability of copolymers of chlorofluorocarbons and vinylidene fluoride to be crosslinked with free radical initiators. These initiators can be made active by UV (actinic) radiation, gaining the advantages of embedment adhesives.

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