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Rate Model for Additive Copper Plating Bath

IP.com Disclosure Number: IPCOM000042154D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

McBride, DG: AUTHOR [+2]

Abstract

A rate expression has been developed relating the rate of copper deposition in an additive copper plating bath to the Mix potential of the bath (EMIX), the derivative of EMIX with respect to time, and the derivative of the rate with respect to time. This relation is as follows for rates between 0.06 and 0.110 mils/hr. and EMIX between -550 and -660 mV Cu coupon vs. SCE. Rate = The above equation in its generalized form is: Rate = The specific coefficients are different depending on what portion of the curve below one is operating. The generalized equation can be refined with the aid of electrochemical measurements.

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Rate Model for Additive Copper Plating Bath

A rate expression has been developed relating the rate of copper deposition in an additive copper plating bath to the Mix potential of the bath (EMIX), the derivative of EMIX with respect to time, and the derivative of the rate with respect to time. This relation is as follows for rates between 0.06 and 0.110 mils/hr. and EMIX between -550 and -660 mV Cu coupon vs. SCE. Rate = The above equation in its generalized form is: Rate = The specific coefficients are different depending on what portion of the curve below one is operating. The generalized equation can be refined with the aid of electrochemical measurements.

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