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Substrate for High Power Packaging

IP.com Disclosure Number: IPCOM000042156D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Vanderlee, KA: AUTHOR

Abstract

This article describes a circuit substrate suitable for high temperature processing. The structure shown combines high thermal conductivity and coefficient of thermal expansion matching that of alumina, and the ability to withstand high manufacturing process temperatures. A significant cost and design advantage is provided by this structure which obviates some problems of heat transfer and mechanical integrity. The structure shown comprises a metal core 2 having an alumina or other ceramic coating 4 applied thereto by conventional techniques. Metal core 2 may be a single metal or a clad metal composite. In the figure, the core 2 is a clad metal composite consisting of a nickel alloy with a layer of copper 3 clad on either side.

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Substrate for High Power Packaging

This article describes a circuit substrate suitable for high temperature processing. The structure shown combines high thermal conductivity and coefficient of thermal expansion matching that of alumina, and the ability to withstand high manufacturing process temperatures. A significant cost and design advantage is provided by this structure which obviates some problems of heat transfer and mechanical integrity. The structure shown comprises a metal core 2 having an alumina or other ceramic coating 4 applied thereto by conventional techniques. Metal core 2 may be a single metal or a clad metal composite. In the figure, the core 2 is a clad metal composite consisting of a nickel alloy with a layer of copper 3 clad on either side. Nickel alloy constitutes about 60% of the cross-sectional area, while each copper layer consumes about 20% of the thickness. Such a composite must have a coefficient of thermal expansion matching that of the alumina coating 4. Additionally, it is desirable that the metal core 2 material have a melting point above 900OEC, so that it may be processed through ordinary thick film hybrid circuit manufacturing processes. Since the ceramic coating 4 provides electrical insulation from substrate core metal two, circuitry such as conductors and resistors may be applied thereto. While the structure shown is planar, the core material 2 may be formed into other geometries before ceramic coating 4 is applied. Similarl...