Browse Prior Art Database

Tool for Mounting Wafers on Hoop

IP.com Disclosure Number: IPCOM000042189D
Original Publication Date: 1984-May-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Glusman, L: AUTHOR

Abstract

The object of the tool to be described is to provide an easy way of precisely and repeatably mounting wafers on an existing hoop directly for dicing and picking operations. The proposed method eliminates the need for what is known as the "paper wafer operation", and also for the pre-cut wafer tapes of various sizes. Referring first to Fig. 3, the means for assembling the hoop will be appreciated. Included is an outer ring, an inner ring, and a tape whose tacky surface faces up when being assembled. The hoop is assembled in the following sequence: The inner ring is positioned to accept the tape, and the tape is placed over the ring so as to overlap all around. The outer ring is aligned as shown in Fig. 3 by the broken lines.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 70% of the total text.

Page 1 of 1

Tool for Mounting Wafers on Hoop

The object of the tool to be described is to provide an easy way of precisely and repeatably mounting wafers on an existing hoop directly for dicing and picking operations. The proposed method eliminates the need for what is known as the "paper wafer operation", and also for the pre-cut wafer tapes of various sizes. Referring first to Fig. 3, the means for assembling the hoop will be appreciated. Included is an outer ring, an inner ring, and a tape whose tacky surface faces up when being assembled. The hoop is assembled in the following sequence: The inner ring is positioned to accept the tape, and the tape is placed over the ring so as to overlap all around. The outer ring is aligned as shown in Fig. 3 by the broken lines. When the outer ring is pressed over the tape and is brought down level with the inner ring, the tape becomes pinched between the two rings. Excess tape is trimmed off. In the operation of the tool, the following sequence is followed: 1. Load hoop 4 into nest 1 - transfer arm 5 is over nest 2. 2. Align wafer 6 in nest 2 - transfer arm was indexed over nest 1. 3. Index transfer arm 5 over nest 2. Operator initiates controls which activate a suitable cam (not seen), thereby delivering the wafer to chuck 3. Vacuum is turned ON in chuck 3 and OFF in nest 2. 4. The transfer arm is indexed over nest 1, and nest 1 is pressurized. This causes the hoop tape to "apex", as shown in Fig. 2. The operator presses the controls...