Browse Prior Art Database

Two-Component Photoresist Process for Conductors

IP.com Disclosure Number: IPCOM000042231D
Original Publication Date: 1984-May-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Lahiri, SK: AUTHOR [+2]

Abstract

A method for electroplating a relatively thick conductor by photolithographic techniques is described which utilizes a two-component photoresist. This method prevents the interface delamination halos common when thick dry film resists are used alone, resulting in resist underplate and possible shorting of dense array patterns. The method utilizes conventional techniques to deposit a relatively thin liquid positive photoresist 1 on substrate 2. A relatively thick dry film negative photoresist material 3 is then laminated onto the resist-covered substrate. The desired conductor pattern is then exposed and developed in the negative photoresist material 3. A flood exposure is then produced to expose areas of the positive photoresist material 1 corresponding to the desired conductor pattern, and then developed.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Two-Component Photoresist Process for Conductors

A method for electroplating a relatively thick conductor by photolithographic techniques is described which utilizes a two-component photoresist. This method prevents the interface delamination halos common when thick dry film resists are used alone, resulting in resist underplate and possible shorting of dense array patterns. The method utilizes conventional techniques to deposit a relatively thin liquid positive photoresist 1 on substrate 2. A relatively thick dry film negative photoresist material 3 is then laminated onto the resist-covered substrate. The desired conductor pattern is then exposed and developed in the negative photoresist material 3. A flood exposure is then produced to expose areas of the positive photoresist material 1 corresponding to the desired conductor pattern, and then developed. The two-component photoresist mask enables a relatively thick conductor 4 to be produced in electrical contact with conductive pattern 5 on substrate 2. The desired conductor pattern 4 is produced by a standard plating method, and the photoresist material is then stripped by a suitable solvent.

1