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In-Situ Diamond Disk Conditioning for Double-Sided Wafer Processing Via Chemical Mechanical Planarization

IP.com Disclosure Number: IPCOM000042240D
Publication Date: 2005-Feb-03
Document File: 3 page(s) / 49K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that incorporates an in-situ diamond disk conditioner into commercially available double-sided Chemical Mechanical Planarization (CMP) equipment. Benefits include improved convenience and process stability compared with the current state of the art.

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In-Situ Diamond Disk Conditioning for Double-Sided Wafer Processing Via Chemical Mechanical Planarization

Disclosed is a method that incorporates an in-situ diamond disk conditioner into commercially available double-sided Chemical Mechanical Planarization (CMP) equipment. Benefits include improved convenience and process stability compared with the current state of the art.

Background

Current double-sided polishing equipment is designed to polish bare substrates having no feature topography (for producing a desired finish quality). In this case, a manual brush conditioning is used in between polishing activities to remove any debris on the pad. In-situ pad conditioning does exist, but only for single-sided CMP equipment today (see Figure 1). It is not possible to adapt the current conditioner/conditioning disk design directly to the double-side polish tool, because the conditioning arm prevents the top and bottom pads from contacting each other, making it impossible to sandwich the substrate during polishing.

One strategy under evaluation uses double-sided polishing in the manufacturing of imprinted package substrates (see Figure 2). Double-side polishing doubles the throughput without the expense of doubling the consumables required. However, adaptation of the double-side polishing tool from bare/blanket panel polish to polishing panels containing micro-features requires different polishing pads necessary for achieving high planarization. Current pads contain a specific grooving system to transport slurry to and from the wafer. These particular pads require conditioning to remove materials that have been re-deposited onto the pad. Currently, there is no analogous device/design for in-situ double-side polishing.

General Description

Figure 3 shows the disclosed method with the bottom portion (including pad and platen) of the...