Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Enhanced Wafer Bonding for Three-Dimensional Integration with Increased Mechanical Integrity and Metal Protection

IP.com Disclosure Number: IPCOM000042242D
Publication Date: 2005-Feb-03
Document File: 3 page(s) / 54K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a process that increases the mechanical integrity of bonded wafers for three-dimensional interconnects integration and also improves copper protection.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 55% of the total text.

Enhanced Wafer Bonding for Three-Dimensional Integration with Increased Mechanical Integrity and Metal Protection

Disclosed is a method for a process that increases the mechanical integrity of bonded wafers for three-dimensional interconnects integration and also improves copper protection.

Background

Currently, three-dimensional integration has an oxide recess step to elevate copper lines and features, so that the copper bonding is not hindered by the non-compliant oxide bonding process (see Figure 1). This results in a mechanically and materially compromised wafer with "air gaps" between the copper; this leaves the rest of the wafer unsupported and vulnerable to mechanical breaks in the subsequent wafer thinning process. Further, the copper on un-landed structures can be corroded (see Figure 2).

General Description

The disclosed method creates a uniform bonding across the wafer, with no air gaps inbetween the bonded features; this leads to better mechanical strength and no “pop out” defects. It also covers the copper so that corrosion is prevented and EM performance is improved. The following are steps for the disclosed method:

1.      After the oxide recess process, an appropriate organic film (a polymeric film that is thermoplastic till it is cured, and then is thermosetting) is spun on the recessed wafer (see Figure 3). The film is soft baked to remove almost all the solvent from the organic film.

2.      The organic film, being uncured at this point, is appropriately recesse...