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Method for a CMP pad with controlled pore sizes and distributions

IP.com Disclosure Number: IPCOM000042251D
Publication Date: 2005-Feb-03
Document File: 4 page(s) / 290K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a chemical mechanical planarization (CMP) pad with controlled pore sizes and distributions. Benefits include improved functionality and improved performance.

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Method for a CMP pad with controlled pore sizes and distributions

Disclosed is a method for a chemical mechanical planarization (CMP) pad with controlled pore sizes and distributions. Benefits include improved functionality and improved performance.

Background

      Conventional CMP pads have a nonuniform pore size, uncontrollable pore size and pore distribution, uncontrollable pore height, and uncontrollable pore count that can be observed using a scanning electron microscope (see Figure 1).

      An improved CMP pad is required to improved planarization processing results. 

General description

      The disclosed method manufacturers a CMP pan in a way that controls key parameters, such as the following:

•             Pore size

•             Pore height (diameter or area)

•             Pore shape (cylindrical or square)

•             Pore distribution/density (pore count)

      A polymer molding method forms controllable pores to fit into specific device patterns. The pore density can be varied by controlling the constant circular velocity during publishing.

Advantages

              The disclosed method provides advantages, including:
•             Improved functionality due to enabling control of CMP pad pore characteristics

•             Improved functionality due to enabling customization of the control density for specific device patterns
•             Improved performance due to controlling the pore size, shape, height, and count

Detailed description

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