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Method for a bucky ball ultra-low-k dielectric material

IP.com Disclosure Number: IPCOM000042252D
Publication Date: 2005-Feb-03
Document File: 2 page(s) / 52K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a bucky ball ultra-low dielectric constant (k) dielectric material. Benefits include improved functionality and improved performance.

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Method for a bucky ball ultra-low-k dielectric material

Disclosed is a method for a bucky ball ultra-low dielectric constant (k) dielectric material. Benefits include improved functionality and improved performance.

Background

      Interconnect performance is measured by the resistance capacitance (RC) constant. To decrease capacitance (C), the industry is trying to achieve a material with an ultra-low-k for the interlevel dielectric. The approach is to increase the porosity of the dielectric. Unfortunately, as the porosity increases, the strength of the material (modulus) decreases, leading to reliability issues, particularly during packaging. The issue of a low modulus for an ultra-low-k dielectric material is unsolved and critical.

              Bucky balls, a form of carbon, inherently have an empty core that is a perfect pore (vacuum) that has a k-value of 1, which is the lowest possible value.

General description

      The disclosed method uses bucky balls to create an ultra low k, high strength dielectric.

              The key elements of the disclosed method include:

•             Bucky balls

•             High modulus matrix material (SiO2 or carbonaceous diamond) in which the bucky balls are embedded

•             Process for depositing the bucky balls and the insulating film

Advantages

              The disclosed method provides advantages, including:
•             Improved functionality due to providing an ultra-low-k dielectric material
•             Improved performance due to improving the material strength by combining bucky balls and carbonaceous diamond

Detailed description

              The disclosed method is a high modulus, porous dielectric material with a low dielectric constant. To form the final dielectric material, the buck...