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Method for fast photoresist stripping using deep ultraviolet curing and ozone chemistry

IP.com Disclosure Number: IPCOM000042319D
Publication Date: 2005-Feb-03
Document File: 3 page(s) / 92K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to provide fast photoresist stripping using deep ultraviolet (DUV) curing and ozone chemistry. Benefits include improved performance and improved environmental friendliness.

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Method for fast photoresist stripping using deep ultraviolet curing and ozone chemistry

Disclosed is a method to provide fast photoresist stripping using deep ultraviolet (DUV) curing and ozone chemistry. Benefits include improved performance and improved environmental friendliness.

Background

      Conventional photoresist stripping is a wet process that uses a chemical solvent, such as H2SO4/H2O2. This process consumes costly chemicals and requires expensive disposition. It is slow, expensive, and environmentally unfriendly.

      An alternative is dry stripping that is comprised of reactive plasma ashing steps. It causes radiation damage and is difficult to remove completely. This process is frequently combined with a wet process.

      Another alternative is ozone chemistry. It is too slow to replace conventional techniques in semiconductor manufacturing.

      A method is required that is faster, less expensive and environmentally friendly.

      Photoresist consists of a long and repeated chain of monomer or polymer which composed of carbon and hydrogen. A reaction between polymer and ozone is an oxidation reaction. Oxidation reactions can be classified into two types, direct oxidation and advanced oxidation. Direct oxidation involves molecular ozone and is selective to carbon unsaturated bonds. Ozone is likely to decompose the carbon-hydrogen (C-H) bond of a polymer using alternative reaction pathways with water. This approach is called the advanced oxidation process (AOP, see Figure 1).

General description

      The disclosed method is a photoresist stripping technique that uses ozone chemistry with a combination of the ozone gas and ultraviolet curing. The method is an environmental friendly method with low consumption.

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