Browse Prior Art Database

Multidimensional Transmission Line Package

IP.com Disclosure Number: IPCOM000042363D
Original Publication Date: 1984-May-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Yogi, T: AUTHOR

Abstract

Configuring all wiring dimensions for a high speed, low temperature integrated circuit on the same level on an insulated ground plane provides good transmission line characteristics; where necessary, insulated jumpers are provided as crossovers. The net result has better transmission line characteristics than a package having a separate metallization level for each dimension. In package wiring where high speed and high density are required, it is important to control the impedance of the transmission lines with a good wiring yield. In Josephson packaging, where thin film levels are solely used for wiring, these requirements are particularly critical.

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Multidimensional Transmission Line Package

Configuring all wiring dimensions for a high speed, low temperature integrated circuit on the same level on an insulated ground plane provides good transmission line characteristics; where necessary, insulated jumpers are provided as crossovers. The net result has better transmission line characteristics than a package having a separate metallization level for each dimension. In package wiring where high speed and high density are required, it is important to control the impedance of the transmission lines with a good wiring yield. In Josephson packaging, where thin film levels are solely used for wiring, these requirements are particularly critical. Traditionally, the wiring in such package is accomplished with a vertical structure where two levels of wiring, "X" and "Y" wiring levels, are separated from the ground plane by an insulation layer. This article shows an alternative wiring scheme (see figure) where the traditional "X - Y" wiring concept is replaced by a single primary level wiring 1 plus a "jumper" level 2 which is used only where wiring lines have to cross. There are two obvious advantages in this approach: 1. Constancy of transmission line impedance can be maintained throughout a major part of the wiring. This approach removes the variation in line impedance, such as found in the two-level wiring, because of thickness variation in the ground plane insulation due to additional process steps between "X" and...