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Method for analyzing the super-fill capability of Cu electroplating additives

IP.com Disclosure Number: IPCOM000042377D
Publication Date: 2005-Feb-03
Document File: 3 page(s) / 48K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for analyzing the super-fill capability of copper (Cu) electroplating (EP) additives. Benefits include improved functionality, improved throughput, an improved development environment, and improved cost effectiveness.

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Method for analyzing the super-fill capability of Cu electroplating additives

Disclosed is a method for analyzing the super-fill capability of copper (Cu) electroplating (EP) additives. Benefits include improved functionality, improved throughput, an improved development environment, and improved cost effectiveness.

Background

              Conventionally, Cu EP bath additives are required for the bottom-up fill deposition process. However, with each technological cycle, the bath chemistry must be optimized for achieving bottom-up fill. Wafers are plated at various additive compositions and a focused ion beam/scanning electron microscope (FIB/SEM) is used on multiple sites on the wafer to validate the gap fill. However, this process is time and resource consuming.

      Requirements pertaining to electroplating and gapfill include the following:

•             Analytical techniques to screen and optimize the additive concentrations for completing the gap fill

•             Optimization of the Cu EP additive bath chemistry for future technologies with fewer wafer runs

•             Development of additional Cu EP additives for future generations

•             Reduction of the time and energy spent on SEM/FIB reconfirmation

General description

      The disclosed method screens and optimizes the composition of Cu EP baths for good gap fill performance without running wafers on plating tools. The method reduces the dependence on time- and energy-intensive wafer metrology, such as FIB/SEM cross section analysis.

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to using a standard 3-electrode electrochemical cell set up to collect current voltage characteristics of the plating solution

•             Improved functionality due to identifying, screening, and optimizing EP bath additives for future technologies

•             Improved throughput due to reducing the dependence on plating tool experiments, which reduces the manufacturing time

•             Improved development environment due to using a small sample volume and a requiring a short analysis time

•             Improved cost effectiveness due to reducing the use of SEM/FIB resources

Detailed description

      The disclosed method analyzes the super-fill capability of Cu EP additives. The voltammogram for the copper bath without any additives does not show any hysteresis between the forward and reverse sweep. For the bath with some additives, a small amount of hysteresis and a small amount of suppression occur. For the bath with many additives, the am...