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Set-Up for Measuring the Thermomechanical Properties of Thin Polymer Films

IP.com Disclosure Number: IPCOM000042479D
Original Publication Date: 1984-May-01
Included in the Prior Art Database: 2005-Feb-03
Document File: 3 page(s) / 36K

Publishing Venue

IBM

Related People

Elsner, G: AUTHOR [+3]

Abstract

This article describes a set-up which measures the thermomechanical properties of very thin polymer films, sandwiched polymer films, etc., under conditions similar to those encountered in practice. When polymers (epoxides, polyimides, photoresists, adhesion promoters, magnetic coatings) are used in semiconductor and packaging technology, it is essential to know their thermomechanical properties. Such properties are, for example, the Young's modulus and the mechanical attenuation occurring up to yield point or fracture. The method used to produce the films essentially determines their properties. Therefore, measuring methods are required which are based on the production process used for the polymer films. In semiconductor and packaging technology, the thickness of very thin polymer films (0.

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Set-Up for Measuring the Thermomechanical Properties of Thin Polymer Films

This article describes a set-up which measures the thermomechanical properties of very thin polymer films, sandwiched polymer films, etc., under conditions similar to those encountered in practice. When polymers (epoxides, polyimides, photoresists, adhesion promoters, magnetic coatings) are used in semiconductor and packaging technology, it is essential to know their thermomechanical properties. Such properties are, for example, the Young's modulus and the mechanical attenuation occurring up to yield point or fracture. The method used to produce the films essentially determines their properties. Therefore, measuring methods are required which are based on the production process used for the polymer films. In semiconductor and packaging technology, the thickness of very thin polymer films (0.3 to 20 mm) is primarily adjusted by spin coating. The figure shows a measuring set-up meeting these requirements. It consists of a support in the form of a circular, if necessary, boron-doped, membrane of 5 to 30 mm diameter produced from an Si wafer. The polymer film with the desired thickness of 0.3 to 20 um is applied to this membrane by spin coating. Acoustic or capacitive means are used to produce oscillations in the membrane. Then, the membrane is allowed to oscillate freely at its resonant frequency, and the membrane deflection is capacitively measured as a function of time. For this purpose, a metallic electrode of a defined size, including a connector, is vapor-deposited through a metal mask on the front or the back side of the membrane after the film has been cured at the desired temperature. In a heat-controlled chamber, this measuring set-up is arranged opposite a metal electrode such that the two electrodes are positioned at a defined spacing of 0.1 to 5 mm from each other. The membrane is caused to oscillate by an acoustic oscillation generator or a pressure generator. The measuring set-up is fixed to this generator such th...