Browse Prior Art Database

Surface-Mounted Capacitors

IP.com Disclosure Number: IPCOM000042587D
Original Publication Date: 1984-May-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Schrottke, G: AUTHOR [+2]

Abstract

Capacitors and similarly packaged electronic components are adapted for polarized mounting on printed circuit cards including a third, dummy lead in the electronic component package, providing widened pads on all leads and forming the leads at right angles to the orientation from which they exit the component package. Typically, capacitors have two leads extending from one end. When these components are mounted to printed circuit cards, the leads typically extend through holes in the cards and are soldered to metallic lands on the surface of the card opposite to that from which the component projects. This component lead arrangement is not suitable for surface mounting. With the present technique, the component leads are bent at right angles to the direction from which they exit the end of the component.

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Surface-Mounted Capacitors

Capacitors and similarly packaged electronic components are adapted for polarized mounting on printed circuit cards including a third, dummy lead in the electronic component package, providing widened pads on all leads and forming the leads at right angles to the orientation from which they exit the component package. Typically, capacitors have two leads extending from one end. When these components are mounted to printed circuit cards, the leads typically extend through holes in the cards and are soldered to metallic lands on the surface of the card opposite to that from which the component projects. This component lead arrangement is not suitable for surface mounting. With the present technique, the component leads are bent at right angles to the direction from which they exit the end of the component. The leads are flattened with suitable compression techniques to increase the cross-sectional area of the leads where they will contact the metallic lands of the printed circuit card. The component may then be mounted on the same side of the card as that from which the component will extend. Standard surface mounting techniques, such as automated soldering of the flattened lead pads to the card as well as staking the component to the card with epoxy, are used in mounting the component to the card. In components having asymmetrically placed leads, no dummy lead is needed to provide correctly polarized orientation.

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