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Vibration Soldering Equipment

IP.com Disclosure Number: IPCOM000042625D
Original Publication Date: 1984-Jun-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 2 page(s) / 68K

Publishing Venue

IBM

Related People

Backes, JL: AUTHOR [+3]

Abstract

It has been demonstrated that the solderability of circuit boards is greatly improved when the board is mechanically vibrated. Both wave soldering and immersion soldering can benefit from this process. Plated through holes may not be soldered for a number of reasons. Surface tension may prevent solder from entering the hole, debris may plug the hole, or defects in the plating may stop solder from completely filling the hole. Vibrating the plate overcomes these problems for it (a) provides a dynamic force to drive solder into the holes, and (b) reduces the apparent surface tension of the solder (improves the wetting). A fixture for applying vibrations to the board is the subject of this article. Its applications are for immersion soldering or immersion wave soldering. Fig.

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Vibration Soldering Equipment

It has been demonstrated that the solderability of circuit boards is greatly improved when the board is mechanically vibrated. Both wave soldering and immersion soldering can benefit from this process. Plated through holes may not be soldered for a number of reasons. Surface tension may prevent solder from entering the hole, debris may plug the hole, or defects in the plating may stop solder from completely filling the hole. Vibrating the plate overcomes these problems for it (a) provides a dynamic force to drive solder into the holes, and (b) reduces the apparent surface tension of the solder (improves the wetting). A fixture for applying vibrations to the board is the subject of this article. Its applications are for immersion soldering or immersion wave soldering. Fig. 1 shows a top view of the board and its mounting fixture. A knife-edge supports the board, which is held in position by several toggle-type hold-down clamps. This form of mounting is important for (a) it provides a good seal to prevent solder from flooding the board, and (b) it provides a better impedance match than a more rigidly clamped edge. A solder barrier, in the form of a wall, also helps to prevent solder from flooding the board. Just beyond the solder barrier are a series of milled slots. These make the support for the board much less rigid, which again helps to provide a better impedance match for traveling waves at the plate's boundary. A side-view in Fig...