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Through-Hole Cleaning Process

IP.com Disclosure Number: IPCOM000042644D
Original Publication Date: 1984-Jun-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Felice, DB: AUTHOR [+4]

Abstract

More thorough cleaning of newly plated through-holes in circuit panels is accomplished by reverse flushing with deionized water, then drying the panels by applying hot air in alternating directions. The flushing is accomplished by supporting a panel horizontally at mid-position in a chamber with the panel edges sealed. Clean, pressurized deionized water up to 1.5 psi is forced in one direction through the plated holes for a limited time, then clean water is forced through those holes in an opposite direction for the same time period. The water is used for a single flushing direction only. When the flushing is completed, air knives are used to remove the excess water. Thereafter, the through-holes are subjected to pressurized hot air in first one direction and then the other for limited times until the holes are dried.

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Through-Hole Cleaning Process

More thorough cleaning of newly plated through-holes in circuit panels is accomplished by reverse flushing with deionized water, then drying the panels by applying hot air in alternating directions. The flushing is accomplished by supporting a panel horizontally at mid-position in a chamber with the panel edges sealed. Clean, pressurized deionized water up to 1.5 psi is forced in one direction through the plated holes for a limited time, then clean water is forced through those holes in an opposite direction for the same time period. The water is used for a single flushing direction only. When the flushing is completed, air knives are used to remove the excess water. Thereafter, the through-holes are subjected to pressurized hot air in first one direction and then the other for limited times until the holes are dried. The air cycle is several times longer than the rinse cycle.

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