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Browse Prior Art Database

Fast Plating Bath

IP.com Disclosure Number: IPCOM000042781D
Original Publication Date: 1984-Jun-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Arbach, GV: AUTHOR [+5]

Abstract

A plating bath having an enhanced plating rate can be achieved by the use of a mixture of reducing agents in the plating bath. For example, a fast electroless copper plating bath comprises a copper salt, EDTA, formaldehyde in a concentration of about 0.03 molar to about 0.05 molar, and dimethylamine borane in a concentration from about 0.00005 molar to about 0.005 molar.

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Fast Plating Bath

A plating bath having an enhanced plating rate can be achieved by the use of a mixture of reducing agents in the plating bath. For example, a fast electroless copper plating bath comprises a copper salt, EDTA, formaldehyde in a concentration of about 0.03 molar to about 0.05 molar, and dimethylamine borane in a concentration from about 0.00005 molar to about 0.005 molar.

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