Browse Prior Art Database

Avoiding Card Delamination

IP.com Disclosure Number: IPCOM000042784D
Original Publication Date: 1984-Jun-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gerber, PA: AUTHOR [+2]

Abstract

This article describes improvements in avoiding delamination of printed circuit cards during wave soldering. Raw card delamination can be avoided or eliminated if the temperature achieved by the raw card is controlled. Temperature gradient may be controlled by reducing the amount of heat transferred by the molten solder. This reduction is accomplished by drilling only the holes required or screen coating a protective material over unused holes. The amount of heat transferred by the molten solder may also be reduced if the protective coating is impregnated with a heat resistant pigment. Finally, use of a low temperature solder reduces the heat transfer.

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Avoiding Card Delamination

This article describes improvements in avoiding delamination of printed circuit cards during wave soldering. Raw card delamination can be avoided or eliminated if the temperature achieved by the raw card is controlled. Temperature gradient may be controlled by reducing the amount of heat transferred by the molten solder. This reduction is accomplished by drilling only the holes required or screen coating a protective material over unused holes. The amount of heat transferred by the molten solder may also be reduced if the protective coating is impregnated with a heat resistant pigment. Finally, use of a low temperature solder reduces the heat transfer. In combination with reducing the amount of heat transferred, installing an air cooler on the wave solder machine controllably regulates the temperature as the card exits the solder pot.

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