Browse Prior Art Database

New Thermal Paste

IP.com Disclosure Number: IPCOM000043070D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

DiPaolo, N: AUTHOR

Abstract

This new dielectric thermal paste is a viscous and flowable semi-metallic composition. The operation of highly integrated semiconductor devices generates a significant amount of heat which must be dissipated to maintain the operating parameters within design ranges and prevent destruction of the device. This heat is conventionally dissipated by either backbonding the device to a suitable substrate and making suitable cooling provision for the substrate or, in the instance of flip-chip-bonded devices, removing heat from the back side of the device with a suitable, thermally conductive structure. A known conductive structure provides the cover of the package in close proximity to the device and provides a thermally conductive viscous paste material between the backside of the device and cover.

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New Thermal Paste

This new dielectric thermal paste is a viscous and flowable semi-metallic composition. The operation of highly integrated semiconductor devices generates a significant amount of heat which must be dissipated to maintain the operating parameters within design ranges and prevent destruction of the device. This heat is conventionally dissipated by either backbonding the device to a suitable substrate and making suitable cooling provision for the substrate or, in the instance of flip-chip-bonded devices, removing heat from the back side of the device with a suitable, thermally conductive structure. A known conductive structure provides the cover of the package in close proximity to the device and provides a thermally conductive viscous paste material between the backside of the device and cover. This thermal paste is formed of pure copper powder spheres in an amount approximately 85% by weight, pure boron nitride powder in an amount approximately 5.4% by weight, and a hydrocarbon binder in an amount approximately 9.6% by weight. The binder preferably consists of polyisobutylene resin and mineral oil. The copper spheres have an average diameter of .0056 inch and the sphere diameter can vary according to the gap where the thermal paste is applied.

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